Low dielectric thermoplastic polyimide "Saprime" for high-speed communication devices (5G)
Super engineering plastics with excellent dielectric properties over a wide frequency range, suitable for next-generation (5G) communication equipment!
"Supreme" has excellent dielectric properties and is resistant to high temperatures and humidity, making it suitable for use in 5G-related components (copper-clad laminates), raw materials for CFRP, and parts for acoustic devices. 【Features】 ■ Good dielectric properties across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance and insoluble in solvents ■ Can be processed from thin films of less than 25μm to large components up to 100mm thick *For more details, please refer to the PDF document or feel free to contact us.
- Company：三菱ガス化学株式会社 グリーン・エネルギー＆ケミカル事業部門
- Price：Other
